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TXS02612ZQSR - Texas Instruments

Description: TXS02612 SDIO PORT EXPANDER WITH

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TXS02612ZQSR - Texas Instruments - PCB symbol
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PCB Footprints
TXS02612ZQSR - Texas Instruments PCB footprint - BGA - BGA - ZQS(S-PBGA-N24)_2021
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3D Models
TXS02612ZQSR - Texas Instruments - 3D model - BGA - ZQS(S-PBGA-N24)_2021
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TXS02612ZQSR Details

  • Manufacturer Part Number:

    TXS02612ZQSR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Clock Frequency-Max:

    60 MHz

  • JESD-30 Code:

    S-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    15

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA24,5X5,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.036 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    PARALLEL IO PORT, GENERAL PURPOSE

TXS02612ZQSR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TXS02612ZQSR involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The TXS02612ZQSR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow TI's thermal management guidelines for optimal performance.
  • The TXS02612ZQSR has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent damage. Use ESD-safe materials, handle devices by the body, and avoid over-handling or touching pins.
  • Yes, the TXS02612ZQSR is qualified for automotive and high-reliability applications. It meets AEC-Q100 standards and is manufactured using automotive-grade processes. However, ensure you follow TI's specific guidelines for these applications.
  • Start by reviewing the datasheet and application notes, then check the PCB layout, power supply, and signal integrity. Use oscilloscopes and logic analyzers to debug issues. TI also provides technical support and resources to help troubleshoot problems.

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TXS02612ZQSR Overview

Use the download button to access the TXS02612ZQSR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TXS02, or try a keyword search, such as Parallel IO Ports

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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