Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TZMC3V3-GS08 - Vishay

Description: Vishay, 3.3V Zener Diode 5% 500 mW SMT 2-Pin MiniMELF

Download TZMC3V3-GS08 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TZMC3V3-GS08 - Vishay - PCB symbol
click to zoom
PCB Footprints
TZMC3V3-GS08 - Vishay PCB footprint - Other - Other - TZMC3V3-GS08-2
click to zoom

TZMC3V3-GS08 Details

  • Manufacturer Part Number:

    TZMC3V3-GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e2

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver (Sn97.5Ag2.5)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    -1.65 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

TZMC3V3-GS08 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TZMC3V3-GS08 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, the TZMC3V3-GS08 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure reliability in high-humidity environments, it is recommended to use a moisture-resistant coating or conformal coating on the device, and to follow proper handling and storage procedures to prevent moisture absorption.
  • The recommended soldering profile for the TZMC3V3-GS08 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It is also recommended to use a solder with a melting point above 217°C.
  • Yes, the TZMC3V3-GS08 is designed to withstand vibrations up to 10 G, making it suitable for use in high-vibration applications. However, it is recommended to follow proper mounting and attachment procedures to ensure the device's reliability.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TZMC3V3-GS08 Overview

Use the download button to access the TZMC3V3-GS08 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like TZMC3, or try a keyword search, such as Zener Diodes

Parts related to TZMC3V3-GS08

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑