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TZMC3V9-GS18 - Vishay

Description: Zener Diodes 3.9 Volt 0.5 Watt 5%

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Symbol
TZMC3V9-GS18 - Vishay - PCB symbol
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PCB Footprints
TZMC3V9-GS18 - Vishay PCB footprint - Other - Other - MiniMELF Glass Case (SOD-80)
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3D Models
TZMC3V9-GS18 - Vishay - 3D model - Other - MiniMELF Glass Case (SOD-80)
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TZMC3V9-GS18 Details

  • Manufacturer Part Number:

    TZMC3V9-GS18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e2

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.9 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver (Sn97.5Ag2.5)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    -1.95 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

TZMC3V9-GS18 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TZMC3V9-GS18 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the TZMC3V9-GS18 has a maximum operating temperature of 150°C, it's not recommended for high-temperature applications above 125°C. Prolonged exposure to high temperatures can affect the device's reliability and lifespan.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component, and avoid applying excessive force or pressure during the soldering process.
  • Yes, the TZMC3V9-GS18 is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and temperature guidelines to ensure reliable solder joints.
  • The typical power dissipation of the TZMC3V9-GS18 is around 1.5 W to 2 W, depending on the operating conditions and ambient temperature. It's essential to ensure proper thermal management and heat dissipation to prevent overheating and ensure reliable operation.

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TZMC3V9-GS18 Overview

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