A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a thermal relief pattern on the bottom layer, and to use thermal vias to dissipate heat efficiently.
To ensure reliable soldering, use a soldering profile with a peak temperature of 240°C to 260°C, and a dwell time of 30-60 seconds. Also, use a solder with a melting point above 217°C to prevent thermal damage.
The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
To handle ESD protection, use a human body model (HBM) of 2kV and a machine model (MM) of 200V. Also, use ESD protection devices such as TVS diodes or ESD arrays on the input lines.
The recommended operating temperature range for the TZS4679-GS08 is -40°C to 125°C, with a maximum junction temperature of 150°C.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TZS4679-GS08 Overview
Use the download button to access the TZS4679-GS08 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like TZS46,
or try a keyword search, such as Zener Diodes