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U309 - InterFET

Description: JFET N-Channel -25V Low Noise

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U309 - InterFET PCB footprint - Other - Other - TO-52_Master
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U309 - InterFET  - 3D model - Other - TO-52_Master
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U309 Details

  • Manufacturer Part Number:

    U309

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    InterFET Corporation

  • Case Connection:

    GATE

  • Configuration:

    SINGLE

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    2.5 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-52

  • JESD-30 Code:

    O-MBCY-W3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Power Gain-Min (Gp):

    10 dB

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

U309 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for U309 is -55°C to 150°C, although it can withstand up to 175°C for short periods.
  • To ensure reliable operation of U309 in high-frequency applications, it's essential to follow proper PCB layout and design guidelines, including minimizing lead lengths, using proper grounding, and avoiding parasitic inductances.
  • The maximum allowable power dissipation for U309 is 1.5 W at 25°C, and it decreases as the temperature increases. It's essential to ensure that the device does not exceed this power rating to prevent thermal damage.
  • Yes, U309 can be used in switching applications, but it's essential to ensure that the device is properly biased and that the switching frequency is within the recommended range to prevent overheating and reduce electromagnetic interference (EMI).
  • To handle ESD protection for U309, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design, such as TVS diodes or ESD protection arrays.

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Part Image U309 Motorola Semiconductor Products

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