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U30D40C - MOSPEC

Description: DIODE, ULTRAFAST, 30A, TO-247; Repetitive Reverse Voltage Vrrm Max:400V; Forward Current If(AV):30A; Diode Configuration:Dual Common Cathode; Forward Voltage VF Max:1.3V; Reverse Rec; Available until stocks are exhausted

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PCB Footprints
U30D40C - MOSPEC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (3P)_2026
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3D Models
U30D40C - MOSPEC  - 3D model - Transistor Outline, Vertical - TO-247 (3P)_2026
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U30D40C Details

  • Manufacturer Part Number:

    U30D40C

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Mospec Semiconductor Corp

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

U30D40C Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure good thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature and adjust the design accordingly.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the switching frequency is within the recommended range (up to 1MHz). Also, consider the device's power dissipation and thermal performance.
  • Follow proper ESD handling procedures during assembly and storage. Use ESD-protective packaging and handling equipment to prevent damage.

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U30D40C Overview

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