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UC1707J883B - Texas Instruments

Description: 16-Pin CDIP Package 1.5 A Totem Pole Outputs

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UC1707J883B - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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UC1707J883B - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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UC1707J883B Details

  • Manufacturer Part Number:

    UC1707J883B

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    1.5 A

  • Output Peak Current Limit-Nom:

    1.5 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.05 µs

  • Width:

    7.62 mm

UC1707J883B Frequently Asked Questions (FAQs)

  • A good PCB layout for the UC1707J883B involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. TI provides a recommended layout in their application notes and evaluation boards.
  • To ensure stability, follow the datasheet's guidelines for output capacitor selection, and consider adding a small series resistor (e.g., 1-10 ohms) between the output capacitor and the load. Additionally, ensure the input voltage is well-regulated and the output is properly decoupled.
  • The UC1707J883B is rated for a maximum output current of 1.5A. However, this rating is dependent on the input voltage, output voltage, and ambient temperature. Be sure to check the datasheet's thermal derating curves and output current vs. input voltage graphs to ensure your design stays within safe operating conditions.
  • The UC1707J883B is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Be sure to check the datasheet's thermal derating curves and consider using thermal management techniques, such as heat sinks or thermal interfaces, to keep the device within its recommended operating temperature range.
  • The output capacitor selection depends on the output voltage, output current, and desired ripple voltage. A general rule of thumb is to choose a capacitor with a capacitance value of at least 10uF and a voltage rating of at least 2x the output voltage. Additionally, consider using a low-ESR capacitor to minimize output voltage ripple.

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UC1707J883B Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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