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UC1836J - Texas Instruments

Description: LDO Cntrlr REG Adjustable 2.5V to 35V 600mA 8-Pin CDIP Tube

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UC1836J - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)_1
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UC1836J - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)_1
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UC1836J Details

  • Manufacturer Part Number:

    UC1836J

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2.5 A

  • Output Voltage-Max:

    35 V

  • Output Voltage-Min:

    2.5 V

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    38535Q/M;38534H;883B

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    35 V

  • Supply Voltage-Min (Vsup):

    5.2 V

  • Supply Voltage-Nom (Vsup):

    6 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Width:

    7.62 mm

UC1836J Frequently Asked Questions (FAQs)

  • The UC1836J is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends a 4-layer PCB with a solid ground plane, and the device should be placed close to the input capacitors. The output inductor and diode should be placed close to the device, and the output capacitor should be placed close to the load. A good layout will help reduce EMI and improve the device's performance.
  • The input capacitor should be a low-ESR ceramic capacitor with a voltage rating of at least 2x the input voltage. The output capacitor should be a low-ESR ceramic or film capacitor with a voltage rating of at least 2x the output voltage. The capacitor values should be chosen based on the desired output ripple and transient response. TI recommends using X5R or X7R ceramic capacitors for their low ESR and high reliability.
  • The UC1836J has a maximum ambient temperature rating of 85°C. However, the device's junction temperature (TJ) should not exceed 150°C. The ambient temperature should be derated based on the device's power dissipation and the thermal resistance of the PCB and heat sink.
  • The output voltage ripple can be calculated using the following formula: ΔVout = (Iout * ESR) / (fsw * Cout), where Iout is the output current, ESR is the output capacitor's equivalent series resistance, fsw is the switching frequency, and Cout is the output capacitance. TI recommends keeping the output voltage ripple below 1% of the output voltage for most applications.
  • The recommended switching frequency for the UC1836J is between 200 kHz and 500 kHz. However, the optimal switching frequency will depend on the specific application and the trade-offs between efficiency, size, and cost. TI recommends using a switching frequency of around 300 kHz for most applications.

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UC1836J Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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