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UCC1802J883B - Texas Instruments

Description: UCC1802J883B

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UCC1802J883B - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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UCC1802J883B Details

  • Manufacturer Part Number:

    UCC1802J883B

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

UCC1802J883B Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in their application note SLUA271, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value of 10-22 μF. Additionally, consider the capacitor's ESR (Equivalent Series Resistance) and ESL (Equivalent Series Inductance) to ensure it can handle the high-frequency switching of the UCC1802J883B.
  • The UCC1802J883B is rated for operation up to 125°C ambient temperature, but it's essential to consider the device's junction temperature (Tj) which should not exceed 150°C. Ensure proper thermal management, such as heat sinking and airflow, to maintain a safe operating temperature and prevent thermal shutdown.
  • Yes, the UCC1802J883B is a radiation-hardened device, making it suitable for high-reliability and aerospace applications. However, it's essential to follow the specific requirements and guidelines for these applications, such as those outlined in the NASA Electronic Parts and Packaging (NEPP) program or the European Space Agency's (ESA) ESCC (European Space Components Coordination) program.
  • To troubleshoot issues with the UCC1802J883B, start by verifying the PCB layout and component selection against the recommended guidelines. Check for proper input and output filtering, and ensure the device is properly decoupled. Use oscilloscopes and spectrum analyzers to measure the input and output waveforms, and look for signs of oscillation or instability. Consult the Texas Instruments application notes and technical support resources for further guidance.

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UCC1802J883B Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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