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UCC1805J883B - Texas Instruments

Description: Low-Power BiCMOS Current-Mode PWM

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UCC1805J883B - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8) CERAMIC
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UCC1805J883B - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8) CERAMIC
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UCC1805J883B Details

  • Manufacturer Part Number:

    UCC1805J883B

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

UCC1805J883B Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA271, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor selection depends on the input voltage, current, and frequency. A general guideline is to choose a capacitor with a voltage rating at least 1.5 times the maximum input voltage, and a capacitance value between 1uF to 10uF. The capacitor should also have a low equivalent series resistance (ESR) to minimize voltage ripple and ensure stable operation.
  • The UCC1805J883B has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management, such as using a heat sink or thermal pad, to prevent overheating and ensure reliable operation.
  • Yes, the UCC1805J883B is a radiation-hardened device, making it suitable for high-reliability and aerospace applications. However, it's essential to follow the specific requirements and guidelines for these applications, such as those outlined in the NASA Electronic Parts and Packaging (NEPP) program or the European Space Agency's (ESA) ESCC (European Space Components Coordination) program.
  • Troubleshooting issues with the UCC1805J883B requires a systematic approach. Start by verifying the input voltage, current, and frequency, and ensuring that the device is properly configured and connected. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. Consult the datasheet, application notes, and Texas Instruments' support resources for guidance on troubleshooting and debugging.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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