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UCC21520ADW - Texas Instruments

Description: 4A/6A, 5.7 kVrms Isolated Dual Channel Gate Driver

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UCC21520ADW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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UCC21520ADW - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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UCC21520ADW Details

  • Manufacturer Part Number:

    UCC21520ADW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-09-15

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    6 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    25 V

  • Supply Voltage1-Min:

    6.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    7.5 mm

UCC21520ADW Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC21520ADW involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended layout in the datasheet and application notes.
  • When selecting an input capacitor for the UCC21520ADW, consider the capacitor's voltage rating, capacitance value, ESR, and ripple current rating. A low-ESR capacitor with a voltage rating above the maximum input voltage and a capacitance value of 10-22 μF is recommended. TI provides guidance on input capacitor selection in the datasheet and application notes.
  • The UCC21520ADW has an operating temperature range of -40°C to 125°C. As the ambient temperature increases, the device's performance may degrade, and the maximum output current may decrease. Ensure proper thermal design and heat sinking to maintain reliable operation within the specified temperature range.
  • The UCC21520ADW has a built-in OCP and SCP feature. To implement OCP, set the OCP threshold using the OCSET pin, and for SCP, use the SCP pin to detect short-circuit conditions. TI provides detailed information on implementing OCP and SCP in the datasheet and application notes.
  • When selecting an output inductor for the UCC21520ADW, consider the inductor's saturation current, DC resistance, and core material. A suitable inductor should have a saturation current above the maximum output current, low DC resistance, and a core material with low core loss. TI provides guidance on output inductor selection in the datasheet and application notes.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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