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UCC21520QDWRQ1 - Texas Instruments

Description: Automotive 4A/6A, 5.7 kVrms Isolated Dual Channel Gate Driver

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UCC21520QDWRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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UCC21520QDWRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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UCC21520QDWRQ1 Details

  • Manufacturer Part Number:

    UCC21520QDWRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    UNDER VOLTAGE

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    6 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    25 V

  • Supply Voltage1-Min:

    9.2 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    7.5 mm

UCC21520QDWRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC21520QDWRQ1 involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing the length of the traces connected to the SW pin.
  • To ensure the UCC21520QDWRQ1 operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Ensure that the device is not subjected to excessive voltage, current, or temperature stress, and that the thermal design is adequate to keep the junction temperature within the recommended range.
  • When selecting the input capacitor (CIN) for the UCC21520QDWRQ1, consider the capacitor's voltage rating, ESR, and RMS current rating. Choose a capacitor with a voltage rating that exceeds the maximum input voltage, a low ESR to minimize voltage ripple, and an RMS current rating that meets the input current requirements.
  • To optimize the output filter design for the UCC21520QDWRQ1, consider the output voltage ripple requirements, output current, and switching frequency. Choose an output capacitor with a suitable voltage rating, ESR, and RMS current rating, and optimize the inductor value to achieve the desired output voltage ripple and transient response.
  • For thermal design and heat sinking, consider the device's power dissipation, junction-to-case thermal resistance, and the maximum junction temperature. Ensure good thermal contact between the device and the heat sink, and use a heat sink with a suitable thermal resistance to keep the junction temperature within the recommended range.

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UCC21520QDWRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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