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UCC23313BDWYR - Texas Instruments

Description: Gate Drivers 4-A, 3.75-kVrms opto-compatible single channel isolated gate driver 6-SOIC -40 to 125

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PCB Footprints
UCC23313BDWYR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWY0006A
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UCC23313BDWYR - Texas Instruments  - 3D model - Small Outline Packages - DWY0006A
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UCC23313BDWYR Details

  • Manufacturer Part Number:

    UCC23313BDWYR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-10-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current-Max:

    4.5 A

  • Output Peak Current Limit-Nom:

    4.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP6,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    3.55 mm

  • Supply Voltage-Max:

    33 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    10 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.105 µs

  • Turn-on Time:

    0.105 µs

  • Width:

    4.68 mm

UCC23313BDWYR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC23313BDWYR involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to provide adequate thermal conductivity and should be attached using a thermal interface material. Additionally, ensure good airflow around the device and avoid blocking airflow with nearby components.
  • When using the UCC23313BDWYR, it's essential to consider EMI filtering to minimize electromagnetic interference. This can be achieved by using a pi-filter or a common-mode choke at the input, and a ferrite bead or a capacitor at the output. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is placed away from sensitive components.
  • To troubleshoot issues with the UCC23313BDWYR, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly cooled and that the PCB layout is correct. Use an oscilloscope to check for voltage ripple or oscillations, and ensure that the device is not overheating. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • The UCC23313BDWYR is a high-voltage, high-current device with a wide input voltage range and a high power density. Compared to other similar devices, it offers a higher output current, a wider input voltage range, and a more compact package. However, it may have a higher voltage drop and a lower efficiency compared to other devices. Consult the datasheet and application notes for specific comparisons and trade-offs.

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UCC23313BDWYR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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