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UCC27200DR - Texas Instruments

Description: 120V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver

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UCC27200DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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UCC27200DR - Texas Instruments  - 3D model - Small Outline Packages - D(R-PDSO-G)
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UCC27200DR Details

  • Manufacturer Part Number:

    UCC27200DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    8 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC27200DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27200DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended layout in the datasheet and application notes.
  • TI provides a component selection guide in the datasheet and application notes. Additionally, you can use online tools like TI's Power Stage Designer or Webench to help select components based on your specific application requirements.
  • The UCC27200DR has a maximum junction temperature of 150°C. Ensure good thermal conduction by using a heat sink or thermal pad, and follow TI's thermal design guidelines. Also, consider using a thermistor or thermal monitoring IC to monitor the temperature and prevent overheating.
  • The UCC27200DR has a built-in overcurrent protection feature. You can also use external components, such as a current sense resistor and a comparator, to implement overcurrent protection. For short-circuit protection, use a fuse or a current-limiting circuit to prevent damage to the device.
  • Use a common-mode choke and X-capacitors to filter out EMI. Ensure good shielding by using a metal enclosure and keeping the PCB away from the enclosure walls. Also, use a shielded cable for the output and input connections.

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UCC27200DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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