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UCC27200QDDARQ1 - Texas Instruments

Description: Automotive 120V Boot, 3A Peak, High Frequency, High-Side/Low-Side Driver

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UCC27200QDDARQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (PDSO-G8)
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UCC27200QDDARQ1 - Texas Instruments  - 3D model - Small Outline Packages - DDA (PDSO-G8)
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UCC27200QDDARQ1 Details

  • Manufacturer Part Number:

    UCC27200QDDARQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    8 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC27200QDDARQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA645, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The selection of external components depends on the specific application requirements, such as the input voltage, output voltage, and switching frequency. Texas Instruments provides guidelines and equations in the datasheet and application notes to help engineers select the right components. Additionally, the TI Power Stage Designer tool can be used to simplify the component selection process.
  • The maximum junction temperature of the UCC27200QDDARQ1 is 150°C. To ensure it stays within the safe operating range, engineers should follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing power losses. The thermal resistance of the package and the maximum power dissipation can be found in the datasheet.
  • Texas Instruments provides troubleshooting guides and application notes that can help engineers identify and resolve common issues with the UCC27200QDDARQ1. Additionally, the TI E2E community forum and technical support team can provide further assistance and guidance.
  • Yes, the UCC27200QDDARQ1 is compatible with lead-free soldering processes. Texas Instruments ensures that its products meet the requirements of the RoHS (Restriction of Hazardous Substances) directive and are compatible with lead-free soldering processes.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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