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UCC27201ADRMT - Texas Instruments

Description: Texas Instruments UCC27201ADRMT, Dual MOSFET Power Driver 3A Full/Half Bridge, 8 → 17 V, Non-Inverting, 8-Pin

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PCB Footprints
UCC27201ADRMT - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRM0008A
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3D Models
UCC27201ADRMT - Texas Instruments  - 3D model - Small Outline No-lead - DRM0008A
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UCC27201ADRMT Details

  • Manufacturer Part Number:

    UCC27201ADRMT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.16,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.007 µs

  • Turn-on Time:

    0.007 µs

  • Width:

    4 mm

UCC27201ADRMT Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27201ADRMT involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loop areas. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure reliable start-up and shutdown, ensure that the input voltage (VIN) rises monotonically and exceeds the UVLO threshold (typically 2.5V) before the enable pin (EN) is asserted. Also, ensure that the output voltage is fully discharged before shutdown to prevent unwanted oscillations.
  • The UCC27201ADRMT has a thermal pad that must be connected to a solid ground plane to dissipate heat efficiently. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if high power dissipation is expected.
  • The compensation network for the UCC27201ADRMT involves selecting the right values for the compensation components (R1, R2, C1, and C2). TI provides a compensation calculator tool and application notes to help optimize the compensation network for specific applications.
  • To minimize EMI and noise, use a common-mode choke and a differential-mode filter at the input, and consider adding a shielded inductor and a snubber network to reduce radiated emissions. Also, ensure good PCB layout practices, such as separating noisy and quiet areas, and using a solid ground plane.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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