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UCC27201AQDDARQ1 - Texas Instruments

Description: Gate Drivers Automotive 120-V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver 8-SO PowerPAD -40 to 125

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UCC27201AQDDARQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA-008
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UCC27201AQDDARQ1 Details

  • Manufacturer Part Number:

    UCC27201AQDDARQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.05 µs

  • Width:

    3.9 mm

UCC27201AQDDARQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27201AQDDARQ1 involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing the length of the power traces. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure the UCC27201AQDDARQ1 operates within its SOA, monitor the device's junction temperature (TJ), input voltage (VIN), and output current (IOUT). Ensure TJ < 150°C, VIN < 18V, and IOUT < 2A. Also, follow the recommended thermal design and PCB layout guidelines.
  • When selecting L and COUT, consider the desired output voltage ripple, inductor core loss, and capacitor ESR. Choose an inductor with a high saturation current and low DCR. Select a capacitor with a high capacitance, low ESR, and suitable voltage rating. TI provides guidelines for component selection in the datasheet and application notes.
  • To troubleshoot issues with the UCC27201AQDDARQ1, start by verifying the PCB layout, component selection, and soldering quality. Check for proper decoupling, filtering, and grounding. Use an oscilloscope to analyze the switching waveforms and identify any anomalies. Consult the datasheet, application notes, and TI's support resources for guidance.
  • The UCC27201AQDDARQ1 is a high-performance, high-frequency (up to 2.2 MHz) synchronous buck converter with a wide input voltage range (4.5V to 18V). It differs from other TI devices in its high switching frequency, low quiescent current, and small package size. Compare the datasheets and application notes of similar devices to determine the best fit for your specific design requirements.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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