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UCC27210D - Texas Instruments

Description: 120V Boot, 4A Peak, High Frequency High-Side Low-Side Driver

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UCC27210D - Texas Instruments - PCB symbol
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PCB Footprints
UCC27210D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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3D Models
UCC27210D - Texas Instruments - 3D model - Small Outline Packages - D0008A
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UCC27210D Details

  • Manufacturer Part Number:

    UCC27210D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.2 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    122 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.4 µs

  • Turn-on Time:

    0.6 µs

  • Width:

    3.9 mm

UCC27210D Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27210D involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loops. TI provides a recommended layout in the datasheet and application notes.
  • TI provides a component selection guide in the datasheet and application notes. Additionally, you can use online tools like TI's Power Stage Designer or Webench to help select components and optimize your design.
  • The UCC27210D has a maximum junction temperature (TJ) of 150°C. Ensure good thermal conduction by using a heat sink or thermal pad, and follow TI's thermal design guidelines. Also, consider using a thermistor or thermal monitoring IC to monitor the device temperature.
  • The UCC27210D has a built-in OCP and SCP feature. Set the OCP threshold using the OCSET pin, and use the SCP pin to detect short-circuit conditions. You can also use external circuitry to enhance protection features.
  • Use a common-mode choke and X-capacitors to filter EMI. Ensure the PCB layout is optimized for EMI reduction, and consider using shielding or metal enclosures. TI provides EMI compliance guidelines and application notes to help you meet regulatory standards.

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UCC27210D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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