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UCC27323DG4 - Texas Instruments

Description: Gate Drivers Dual 4 A Peak High Speed Low-Side

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UCC27323DG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC27323DG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC27323DG4 Details

  • Manufacturer Part Number:

    UCC27323DG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3.9 mm

UCC27323DG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA623, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The UCC27323DG4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. Ensure the thermal plane is connected to a heat sink or a large copper area on the PCB, and follow the thermal management guidelines in the datasheet and application notes.
  • The maximum allowed voltage on the input pins of the UCC27323DG4 is 6V, which is higher than the recommended operating voltage of 5V. However, exceeding 6V can cause damage to the device.
  • Yes, the UCC27323DG4 is qualified for automotive and high-reliability applications, and meets the requirements of the AEC-Q100 standard. However, additional testing and validation may be required for specific applications.
  • Start by verifying the input voltage, clock frequency, and output load. Check for proper PCB layout, component selection, and thermal management. Use an oscilloscope to measure the output voltage and clock signal. Consult the datasheet, application notes, and Texas Instruments' support resources for further guidance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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