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UCC27324QDRQ1 - Texas Instruments

Description: Automotive Dual 4A High Speed Low-Side MOSFET Driver

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UCC27324QDRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC27324QDRQ1 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC27324QDRQ1 Details

  • Manufacturer Part Number:

    UCC27324QDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    4 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3.9 mm

UCC27324QDRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27324QDRQ1 involves keeping the input and output stages separate, using a ground plane, and minimizing trace lengths and loops. TI provides a recommended layout in the datasheet and application notes.
  • Proper thermal management involves providing a heat sink or thermal pad, ensuring good airflow, and keeping the device away from heat sources. The thermal resistance of the package (RθJA) is 34.4°C/W, and the maximum junction temperature is 150°C.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (e.g., X5R or X7R) is recommended. The capacitor should be placed close to the VIN pin to minimize noise and ensure stable operation.
  • Troubleshooting involves checking the input voltage, output voltage, and current, as well as the PCB layout and thermal management. Use an oscilloscope to check for voltage ripple, and ensure that the device is properly soldered and connected. Consult the datasheet and application notes for more information.
  • Yes, the UCC27324QDRQ1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard, and TI provides a PPAP (Production Part Approval Process) document for automotive applications.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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