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UCC27511AQDBVRQ1 - Texas Instruments

Description: Single-Channel High-Speed Low-Side Gate Driver with 5V Negative Input Voltage Handling Ability

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PCB Footprints
UCC27511AQDBVRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
UCC27511AQDBVRQ1 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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UCC27511AQDBVRQ1 Details

  • Manufacturer Part Number:

    UCC27511AQDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    8 A

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    1.6 mm

UCC27511AQDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27511AQDBVRQ1 involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance.
  • To ensure the UCC27511AQDBVRQ1 operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Ensure that the device is not subjected to excessive voltage, current, or temperature stress, and that the thermal design is adequate to keep the junction temperature within the recommended range.
  • When selecting the input capacitor (CIN) for the UCC27511AQDBVRQ1, consider the capacitor's voltage rating, capacitance value, equivalent series resistance (ESR), and ripple current rating. Choose a capacitor with a voltage rating that exceeds the maximum input voltage, a capacitance value that meets the required ripple attenuation, and an ESR that minimizes power losses.
  • To optimize the output filter design for the UCC27511AQDBVRQ1, consider the output voltage ripple requirement, output current, and switching frequency. Choose an output capacitor with a suitable capacitance value, ESR, and voltage rating. Optimize the inductor value and type to minimize core losses and ensure the desired output voltage ripple.
  • For thermal design and heat sinking, consider the device's power dissipation, junction-to-case thermal resistance, and maximum junction temperature. Ensure a good thermal interface between the device and heat sink, and select a heat sink with a suitable thermal resistance to keep the junction temperature within the recommended range.

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UCC27511AQDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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