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UCC27523DSDT - Texas Instruments

Description: Dual, 5A, High-Speed Low-Side Power MOSFET Driver

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UCC27523DSDT - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DSD (S-PWSON-N8)
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3D Models
UCC27523DSDT - Texas Instruments  - 3D model - Small Outline No-lead - DSD (S-PWSON-N8)
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UCC27523DSDT Details

  • Manufacturer Part Number:

    UCC27523DSDT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.175 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3 mm

UCC27523DSDT Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27523DSDT involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing the length of the high-current paths. TI provides a recommended PCB layout in the application note SLUA623.
  • To ensure proper thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet. The maximum junction temperature (TJ) is 150°C, and the thermal resistance (RθJA) is 34.4°C/W.
  • When selecting the input capacitor (CIN), consider the voltage rating, capacitance value, and equivalent series resistance (ESR). A low-ESR capacitor with a voltage rating higher than the maximum input voltage is recommended. TI recommends a 10-22 μF ceramic capacitor with an X7R or X5R dielectric.
  • To troubleshoot issues with the UCC27523DSDT, start by verifying the PCB layout, component values, and voltage rails. Check for proper decoupling, and ensure that the input and output capacitors are properly selected. Use an oscilloscope to observe the waveforms and identify any signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • The UCC27523DSDT and UCC27524 are both high-voltage, high-current gate drivers, but they have some key differences. The UCC27523DSDT has a higher peak output current (4 A vs. 2 A) and a faster rise time (10 ns vs. 20 ns). The UCC27524, on the other hand, has a lower quiescent current (1.5 mA vs. 3.5 mA) and a smaller package option (SOIC-8 vs. SOIC-14).

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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