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UCC27524DGN - Texas Instruments

Description: Texas Instruments UCC27524DGN, Dual MOSFET Power Driver 5A, 4.5 → 18 V, Non-Inverting, 8-Pin MSOP

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UCC27524DGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN1 (S-PDSO-G8)
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UCC27524DGN - Texas Instruments  - 3D model - Small Outline Packages - DGN1 (S-PDSO-G8)
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UCC27524DGN Details

  • Manufacturer Part Number:

    UCC27524DGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3.8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.023 µs

  • Turn-on Time:

    0.023 µs

  • Width:

    3 mm

UCC27524DGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27524DGN involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loops. TI provides a recommended layout in the application note SLUA623.
  • The input capacitor should be selected based on the input voltage ripple requirement, output current, and switching frequency. A general guideline is to choose a capacitor with a capacitance value of at least 10uF, a voltage rating of 1.5 to 2 times the input voltage, and a low ESR (equivalent series resistance).
  • The UCC27524DGN is a 24V, 4A synchronous buck converter. The maximum output current depends on the input voltage, output voltage, and thermal conditions. In general, the device can deliver up to 4A of output current with a suitable thermal design and heat sinking.
  • The switching frequency of the UCC27524DGN is adjustable using an external resistor (RT) connected between the RT pin and GND. The switching frequency can be calculated using the formula: fSW = 1 / (RT * 10^6).
  • The EN (enable) pin is used to enable or disable the device. When the EN pin is high, the device is enabled, and when it is low, the device is disabled. This pin can be used to implement power sequencing or to shut down the device during fault conditions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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