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UCC27533DBVT - Texas Instruments

Description: Texas Instruments UCC27533DBVT, MOSFET Power Driver, 5A, 10 → 32 V, 5-Pin SOT-23

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PCB Footprints
UCC27533DBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
UCC27533DBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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UCC27533DBVT Details

  • Manufacturer Part Number:

    UCC27533DBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    140 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.026 µs

  • Turn-on Time:

    0.026 µs

  • Width:

    1.6 mm

UCC27533DBVT Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC27533DBVT involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loop areas to reduce EMI.
  • Proper thermal management involves providing a heat sink or thermal pad to the exposed pad of the QFN package, ensuring good airflow, and keeping the device away from heat sources. The thermal resistance of the package is 24°C/W.
  • When selecting CIN, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). A low-ESR capacitor with a voltage rating above the maximum input voltage is recommended. A value of 10-22 μF is typical.
  • Optimize the output filter by selecting an inductor with low DC resistance and high saturation current, and a capacitor with low ESR. The output filter should be designed to attenuate the switching frequency and its harmonics.
  • When selecting CB, consider a ceramic capacitor with a voltage rating above the maximum input voltage, a capacitance value of 10-100 nF, and a low ESR. The capacitor should be placed close to the IC to minimize parasitic inductance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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