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UCC28019AP - Texas Instruments

Description: 8-Pin Continuous Conduction Mode (CCM) PFC Controller

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UCC28019AP - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC28019AP - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC28019AP Details

  • Manufacturer Part Number:

    UCC28019AP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.81 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    7.5 mA

  • Supply Voltage-Max (Vsup):

    21 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    71 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

UCC28019AP Frequently Asked Questions (FAQs)

  • The UCC28019AP is a high-frequency switching device, so it's crucial to follow good PCB layout practices to minimize electromagnetic interference (EMI) and ensure reliable operation. TI recommends placing the device close to the power stage, using a solid ground plane, and keeping the high-current paths short and wide. Additionally, decoupling capacitors should be placed close to the device's power pins.
  • The choice of external components, such as the transformer, inductor, and capacitors, depends on the specific application and design requirements. TI provides a detailed component selection guide in the datasheet, which includes formulas and guidelines for selecting the right components. Additionally, TI's Webench online design tool can be used to simplify the component selection process.
  • The UCC28019AP is a high-power device that can generate significant heat during operation. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. TI recommends using a heat sink with a thermal resistance of less than 10°C/W and ensuring good airflow around the device. The device's thermal pad should be soldered to a solid copper plane on the PCB to improve heat dissipation.
  • Common issues with the UCC28019AP include oscillations, overvoltage, and overheating. To troubleshoot these issues, TI recommends checking the PCB layout, component selection, and soldering quality. Additionally, using an oscilloscope to monitor the device's voltage and current waveforms can help identify the root cause of the issue. TI's application notes and technical support resources can also provide guidance on troubleshooting and debugging.
  • The UCC28019AP is a high-frequency switching device that can generate electromagnetic interference (EMI). To minimize EMI, TI recommends using a shielded transformer, placing the device in a metal enclosure, and using EMI filters and shielding on the PCB. Additionally, following good PCB layout practices, such as keeping high-current paths short and using a solid ground plane, can help reduce EMI.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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