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UCC2813D-0 - Texas Instruments

Description: Texas Instruments UCC2813D-0, PWM Current Mode Controller, 1 A, 1000 kHz 8-Pin SOIC

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PCB Footprints
UCC2813D-0 - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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3D Models
UCC2813D-0 - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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UCC2813D-0 Details

  • Manufacturer Part Number:

    UCC2813D-0

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    11 V

  • Input Voltage-Min:

    7.5 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.075 V

  • Output Voltage-Min:

    4.925 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    30 mA

  • Supply Voltage-Max (Vsup):

    11 V

  • Supply Voltage-Min (Vsup):

    7.2 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC2813D-0 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC2813D-0 involves keeping the input and output stages separate, using a star-ground configuration, and placing the input filter components close to the IC. Additionally, using a solid ground plane and minimizing trace lengths can help reduce EMI.
  • The choice of input filter components depends on the specific application and the desired level of EMI filtering. A good starting point is to use a combination of ceramic capacitors and ferrite beads, with values selected based on the frequency range of interest and the impedance of the input signal.
  • The maximum power dissipation of the UCC2813D-0 is dependent on the specific application and the thermal environment. A good rule of thumb is to calculate the power dissipation based on the output current and voltage, and then use the thermal resistance of the package to determine the maximum allowable power dissipation.
  • Yes, the UCC2813D-0 is qualified for use in high-reliability and automotive applications. However, it is essential to follow the recommended design and layout guidelines, and to perform thorough testing and validation to ensure the device meets the specific requirements of the application.
  • Common issues with the UCC2813D-0 can often be traced back to poor PCB layout, inadequate input filtering, or incorrect component selection. To troubleshoot, start by verifying the PCB layout and input filter design, and then check the component values and tolerances. If the issue persists, consult the datasheet and application notes for guidance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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