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UCC28740D - Texas Instruments

Description: Constant-Voltage, Constant-Current Flyback Controller Using Opto-Coupler Feedback

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UCC28740D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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UCC28740D - Texas Instruments  - 3D model - Small Outline Packages - D(R-PDSO-G)
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UCC28740D Details

  • Manufacturer Part Number:

    UCC28740D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES IN AM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    FREQUENCY MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    25 V

  • JESD-30 Code:

    R-PDSO-G7

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP7/8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    25 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    100 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC28740D Frequently Asked Questions (FAQs)

  • The UCC28740D requires careful layout and placement to ensure proper operation. TI recommends placing the IC close to the transformer, using a solid ground plane, and keeping the high-current paths short and wide. A 4-layer PCB is recommended, with the top layer for signals, the second layer for power, the third layer for ground, and the bottom layer for power.
  • To optimize the UCC28740D for low standby power consumption, ensure that the IC is in the low-power mode (LPM) during standby. This can be achieved by setting the EN pin low, reducing the switching frequency, and minimizing the voltage on the VCC pin. Additionally, use a low-quiescent-current transformer and optimize the transformer design for low standby power.
  • The UCC28740D has a high power density, so thermal design is critical. Ensure good airflow, use a heat sink if necessary, and optimize the PCB design for thermal performance. The IC's thermal pad should be connected to a solid ground plane, and the PCB should have thermal vias to dissipate heat.
  • To troubleshoot issues with the UCC28740D, start by checking the power supply voltage, input voltage, and output voltage. Verify that the IC is properly configured and that the transformer is properly designed and wound. Use an oscilloscope to check for oscillations or instability, and consult the datasheet and application notes for guidance on troubleshooting common issues.
  • The UCC28740D is a high-frequency switching converter, so EMI and EMC are critical considerations. Ensure that the PCB design minimizes radiated emissions, use a shielded transformer, and add EMI filters as necessary. Follow good layout practices, such as keeping high-frequency signals away from sensitive nodes, and use a common-mode choke to reduce common-mode noise.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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