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UCC37322D - Texas Instruments

Description: Texas Instruments UCC37322D, MOSFET Power Driver 9A, 4 → 15 V, Non-Inverting, 8-Pin SOIC

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UCC37322D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC37322D - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC37322D Details

  • Manufacturer Part Number:

    UCC37322D

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current-Max:

    9 A

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.07 µs

  • Turn-on Time:

    0.07 µs

  • Width:

    3.9 mm

UCC37322D Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC37322D involves keeping the input and output stages separate, using a star-ground configuration, and placing the device close to the power source. Additionally, using a 4-layer PCB with a solid ground plane and a separate power plane can help reduce EMI.
  • To ensure proper thermal management, make sure to provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently.
  • A recommended input filter configuration for the UCC37322D is a pi-filter (L-C-L) or a T-filter (L-C-R-L) to reduce input ripple and noise. The filter components should be chosen based on the specific application requirements and input voltage range.
  • To troubleshoot issues with the UCC37322D, start by checking the PCB layout and component placement for any potential issues. Verify that the input and output capacitors are properly sized and placed. Check the voltage and current waveforms using an oscilloscope to identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When selecting the output inductor for the UCC37322D, consider the inductor's saturation current, DC resistance, and core material. Choose an inductor with a high saturation current rating to handle the peak current requirements. The DC resistance should be low to minimize power losses. The core material should be suitable for the operating frequency and temperature range.

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UCC37322D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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