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UCC3804N - Texas Instruments

Description: UCC3804N, PWM Current Mode Controller, 1 A Boost, Buck, Flyback, 1000 kHz 8-Pin PDIP

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UCC3804N - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC3804N - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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UCC3804N Details

  • Manufacturer Part Number:

    UCC3804N

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.81 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

UCC3804N Frequently Asked Questions (FAQs)

  • The UCC3804N is a high-frequency device, and proper layout and placement are crucial to minimize EMI and ensure reliable operation. TI recommends a 4-layer PCB with a solid ground plane, and placing the UCC3804N close to the input capacitors and output inductors. Additionally, keep the high-frequency nodes (e.g., the switching node) away from sensitive analog nodes.
  • The selection of input and output capacitors depends on the specific application requirements. For the input capacitor, choose a low-ESR capacitor with a high ripple current rating. For the output capacitor, select a capacitor with low ESR and high capacitance to minimize output voltage ripple. TI recommends using ceramic or film capacitors for both input and output.
  • The UCC3804N's output stage can withstand a maximum voltage stress of 1.5 times the nominal output voltage. Exceeding this limit can cause damage to the device. Ensure that the output voltage is within the recommended range to prevent damage.
  • The UCC3804N has a built-in overcurrent protection feature. To implement it, connect a sense resistor (Rs) in series with the output inductor. The sense resistor value depends on the desired overcurrent threshold. When the current through Rs exceeds the threshold, the UCC3804N's overcurrent protection is triggered, and the device shuts down.
  • The UCC3804N is a high-power device that requires proper thermal management. TI recommends using a heat sink with a thermal resistance of less than 10°C/W. Ensure good thermal contact between the device and the heat sink, and use thermal interface material (TIM) if necessary. Additionally, keep the ambient temperature below 85°C to prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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