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UCC38050DR - Texas Instruments

Description: Power Factor Correction - PFC Transition Mode PFC Controller

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UCC38050DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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UCC38050DR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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UCC38050DR Details

  • Manufacturer Part Number:

    UCC38050DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.75 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    200 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

UCC38050DR Frequently Asked Questions (FAQs)

  • The UCC38050DR is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends placing the device close to the power stage, using a solid ground plane, and minimizing the length of the high-current paths. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The choice of external components such as resistors, capacitors, and inductors depends on the specific application and design requirements. TI provides a detailed component selection guide in the datasheet, and engineers can use online tools such as the TI Power Stage Designer to help with component selection.
  • The UCC38050DR has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may be affected at extreme temperatures. Engineers should ensure that the device is operated within the recommended temperature range to ensure optimal performance and reliability.
  • TI provides a detailed troubleshooting guide in the datasheet, which covers common issues such as startup problems, oscillations, and overcurrent faults. Engineers can also use TI's online resources such as the E2E forum and application notes to troubleshoot issues with the UCC38050DR.
  • Yes, the UCC38050DR is compatible with lead-free soldering processes. TI uses lead-free packaging materials that meet the requirements of the RoHS directive. However, engineers should ensure that their soldering process meets the recommended temperature and time profiles to prevent damage to the device.

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UCC38050DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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