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UCC3809P-2 - Texas Instruments

Description: Converter Offline Boost, Buck, Flyback, Forward Topology 1MHz 8-VSSOP

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UCC3809P-2 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC3809P-2 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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UCC3809P-2 Details

  • Manufacturer Part Number:

    UCC3809P-2

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    19 V

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    25 mA

  • Supply Voltage-Max (Vsup):

    19 V

  • Supply Voltage-Min (Vsup):

    15 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1000 kHz

  • Technology:

    BCDMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UCC3809P-2 Frequently Asked Questions (FAQs)

  • The UCC3809P-2 is a high-frequency device, and proper layout and placement are crucial for its operation. TI recommends placing the device close to the power stage, using short and wide traces for the power lines, and separating the high-current and low-current paths. A good layout practice is to use a star-ground configuration and to minimize the loop area of the power stage.
  • The value of the VCC bypass capacitor depends on the specific application and the noise sensitivity of the system. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, with a voltage rating that exceeds the maximum VCC voltage. TI recommends using a low-ESR capacitor with a high self-resonant frequency to ensure effective noise filtering.
  • The maximum allowable voltage on the VREF pin is 5.5V, which is the absolute maximum rating. However, for normal operation, TI recommends keeping the VREF voltage between 4.5V and 5.5V to ensure accurate voltage regulation.
  • The output voltage of the UCC3809P-2 can be adjusted by changing the value of the resistors in the voltage divider network connected to the VREF pin. The output voltage is determined by the ratio of the resistors and the internal reference voltage. TI provides a formula in the datasheet to calculate the output voltage based on the resistor values.
  • The soft-start pin (SS) is used to control the startup sequence of the UCC3809P-2. By connecting a capacitor to the SS pin, the output voltage can be ramped up slowly during startup, reducing the inrush current and preventing voltage overshoots. The value of the capacitor determines the soft-start time, and TI recommends a value between 10nF to 100nF.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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