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UCC5310MCDWVR - Texas Instruments

Description: Driver 4.3A 1-OUT Inv/Non-Inv 8-Pin SOIC T/R

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UCC5310MCDWVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A
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UCC5310MCDWVR - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A
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UCC5310MCDWVR Details

  • Manufacturer Part Number:

    UCC5310MCDWVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-05-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    2.2 A

  • Output Peak Current Limit-Nom:

    2.2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    5.85 mm

UCC5310MCDWVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC5310MCDWVR involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to provide good thermal conductivity and should be attached using a thermal interface material. Additionally, the PCB should be designed to provide good airflow around the device.
  • The recommended input capacitor for the UCC5310MCDWVR is a low-ESR ceramic capacitor with a value of 10uF to 22uF. The recommended output capacitor is a low-ESR ceramic capacitor with a value of 10uF to 47uF. The capacitor values may vary depending on the specific application and output voltage requirements.
  • To troubleshoot issues with the UCC5310MCDWVR, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly configured and that the input and output capacitors are properly sized. Check for any signs of overheating, and verify that the device is properly thermally managed. If the issue persists, consult the datasheet and application notes for further guidance.
  • Operating the UCC5310MCDWVR at high temperatures can reduce its reliability and lifespan. High temperatures can cause the device to degrade over time, leading to reduced performance and eventual failure. It's recommended to operate the device within its specified temperature range to ensure optimal performance and reliability.

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UCC5310MCDWVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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