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UCC5350MCQDQ1 - Texas Instruments

Description: Gate Drivers 5-A/5-A, 3-k/5-kVRMS automotive single-channel isolated gate driver with Miller clamp 8-SOIC -40 to 125

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UCC5350MCQDQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC5350MCQDQ1 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC5350MCQDQ1 Details

  • Manufacturer Part Number:

    UCC5350MCQDQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-05-31

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    3.895 mm

UCC5350MCQDQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC5350MCQDQ1 involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the EN pin to a valid logic level, and configure the device according to the datasheet. Also, ensure that the input voltage is within the recommended range and that the device is properly decoupled.
  • The UCC5350MCQDQ1 has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid overheating the device. Also, follow the recommended thermal design guidelines to prevent thermal shutdown.
  • To troubleshoot issues, start by checking the power supply, input voltage, and output voltage. Verify that the device is properly configured and that the input and output signals are within the recommended ranges. Use an oscilloscope to check for signal integrity and noise. Consult the datasheet and application notes for troubleshooting guidelines.
  • To minimize EMI and EMC issues, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input and output lines. Follow good PCB design practices, such as using a solid ground plane and minimizing loop areas.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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