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UCC5390ECDR - Texas Instruments

Description: 10A/10A 3-kVRMS Single-Channel Isolated Gate Driver for Bipolar Supply (E) or With Split Output (S)

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UCC5390ECDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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UCC5390ECDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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UCC5390ECDR Details

  • Manufacturer Part Number:

    UCC5390ECDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-08-09

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    17 A

  • Output Peak Current Limit-Nom:

    17 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    3.895 mm

UCC5390ECDR Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC5390ECDR involves keeping the input and output stages separate, using a ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended layout in the application note SLUA271.
  • To ensure proper power-up and power-down, follow the recommended power sequencing in the datasheet. Apply power to the VIN pin first, followed by the VCC pin. During power-down, remove power from the VCC pin first, then the VIN pin.
  • The maximum allowed voltage on the input pins of the UCC5390ECDR is 6.5V. Exceeding this voltage can cause damage to the device.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet. The UCC5390ECDR has a thermal shutdown feature that activates when the junction temperature exceeds 150°C.
  • The recommended capacitor value for the VCC bypass capacitor is 0.1 μF to 1 μF, with a voltage rating of 10V or higher. This capacitor helps to filter noise and reduce electromagnetic interference.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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