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UCC5390ECDWV - Texas Instruments

Description: 10A/10A Single-Channel Isolated Gate Driver for Bipolar Supply (E) or With Split Output (S)

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UCC5390ECDWV Details

  • Manufacturer Part Number:

    UCC5390ECDWV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-02-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    17 A

  • Output Peak Current Limit-Nom:

    17 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    33 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.1 µs

  • Width:

    5.85 mm

UCC5390ECDWV Frequently Asked Questions (FAQs)

  • A good PCB layout for the UCC5390ECDWV involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to provide good thermal conductivity and should be attached using a thermal interface material. Additionally, the device should be placed in a well-ventilated area to prevent overheating.
  • Not using the recommended input and output capacitors can lead to reduced performance, increased noise, and decreased stability of the UCC5390ECDWV. The capacitors help to filter out noise and ripple, and ensure that the device operates within its specified voltage range. Using non-recommended capacitors can also lead to device failure or reduced lifespan.
  • To troubleshoot issues with the UCC5390ECDWV, start by checking the input and output voltages, and ensuring that they are within the specified range. Check for any signs of overheating, and verify that the device is properly soldered and connected. Use an oscilloscope to check for any unusual waveforms or noise, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the UCC5390ECDWV is suitable for high-reliability applications. It's designed to meet the requirements of automotive and industrial applications, and is built with high-quality materials and manufacturing processes. However, it's still important to follow proper design and manufacturing practices to ensure the device operates reliably in the specific application.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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