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UCD74120RVFT - Texas Instruments

Description: 14 V, 25 A synchronous buck power stage with output current monitoring

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PCB Footprints
UCD74120RVFT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RVF0040A
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3D Models
UCD74120RVFT - Texas Instruments  - 3D model - Quad Flat No-Lead - RVF0040A
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UCD74120RVFT Details

  • Manufacturer Part Number:

    UCD74120RVFT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    4.7 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC40,.2X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.52 mm

  • Supply Voltage-Max (Vsup):

    14 V

  • Supply Voltage-Min (Vsup):

    4.7 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

UCD74120RVFT Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal resistance. A thermal via array under the device can also improve heat dissipation.
  • Ensure that the device is properly decoupled, and that the power supply is stable and well-regulated. Also, consider using a thermistor or thermocouple to monitor the device temperature and adjust the operating conditions accordingly.
  • Choose capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum output voltage. X5R or X7R ceramic capacitors are recommended. Avoid using electrolytic capacitors due to their high ESR and limited lifespan.
  • Use the TI-provided compensation calculator or consult the application note (SLVA477) for guidance on designing the compensation network. The goal is to achieve a stable, high-bandwidth response with minimal ringing and overshoot.
  • High ambient temperatures can reduce the device's reliability and lifespan. Ensure proper airflow, consider using a heat sink, and derate the device's output current accordingly to prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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