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UCLAMP2271P.TNT - SEMTECH

Description: ESD Suppressors / TVS Diodes 22V, 1-LINE SURGE PROTECTION

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UCLAMP2271P.TNT - SEMTECH - PCB symbol
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PCB Footprints
UCLAMP2271P.TNT - SEMTECH PCB footprint - Other - Other - UCLAMP2271P.TNT-4
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3D Models
UCLAMP2271P.TNT - SEMTECH - 3D model - Other - UCLAMP2271P.TNT-4
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UCLAMP2271P.TNT Details

  • Manufacturer Part Number:

    UCLAMP2271P.TNT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.16

  • Breakdown Voltage-Max:

    33.5 V

  • Breakdown Voltage-Min:

    25.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-5

  • Rep Pk Reverse Voltage-Max:

    22 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

UCLAMP2271P.TNT Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal inductance and capacitance in the signal paths. Use a solid ground plane, and keep the device away from heat sources. A thermal pad on the bottom of the package helps with heat dissipation.
  • Follow proper PCB design and layout guidelines, use shielding and filtering where necessary, and ensure the device is properly grounded. Also, consider using a common-mode choke or ferrite beads to reduce EMI.
  • Use a high-speed oscilloscope with a bandwidth of at least 2 GHz to measure signal integrity. Use a signal generator to test the device's frequency response. Ensure proper probing and measurement techniques to avoid signal degradation.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Store the device in an anti-static bag or container.
  • The UCLAMP2271P.TNT is manufactured according to industry standards such as JEDEC, IEC, and IPC. It meets or exceeds reliability standards for temperature, humidity, and vibration testing.

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UCLAMP2271P.TNT Overview

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