HALOGEN FREE AND ROHS COMPLIANT, ULTRA SMALL, SLP1006, 2 PIN
Pin Count:
2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Manufacturer:
Semtech Corporation
YTEOL:
6.03
Additional Feature:
LOW CAPACITANCE
Clamping Voltage-Max:
7.5 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-XBCC-N2
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Non-rep Peak Rev Power Dis-Max:
40 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
2.5 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
UCLAMP2501T.TCT Frequently Asked Questions (FAQs)
A good PCB layout for the UCLAMP2501T.TCT involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the protected circuit. Additionally, it's recommended to use a common ground point for the input and output grounds.
To choose the right TVS diode, consider the maximum voltage and current requirements of your application, as well as the desired level of protection. The UCLAMP2501T.TCT is a 250W TVS diode, so ensure your application's power requirements are within this range. Also, consider the clamping voltage, response time, and capacitance of the device.
The UCLAMP2501T.TCT has an operating temperature range of -40°C to 150°C, making it suitable for a wide range of applications, including automotive and industrial systems.
Yes, the UCLAMP2501T.TCT is designed to provide ESD protection in addition to overvoltage protection. It meets the IEC 61000-4-2 standard for ESD protection, making it suitable for applications that require ESD protection.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point compatible with the device's package. Also, ensure the PCB is clean and free of oxidation to ensure a strong bond between the device and the PCB.
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UCLAMP2501T.TCT Overview
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