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UCS1003-1-BP - Microchip

Description: Microchip UCS1003-1-BP, USB Power Switch, 20-Pin QFN

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Symbol
UCS1003-1-BP - Microchip - PCB symbol
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PCB Footprints
UCS1003-1-BP - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UCS2113T-1-V/G4
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3D Models
UCS1003-1-BP - Microchip - 3D model - Quad Flat No-Lead - UCS2113T-1-V/G4
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UCS1003-1-BP Details

  • Manufacturer Part Number:

    UCS1003-1-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    QFN-20

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    USB PD CONTROLLER

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max (Isup):

    0.75 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +2.5V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

UCS1003-1-BP Frequently Asked Questions (FAQs)

  • A good PCB layout for UCS1003-1-BP involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive analog circuits can help minimize EMI.
  • To ensure the UCS1003-1-BP operates within the recommended junction temperature range, use a thermal pad or heat sink, and ensure good airflow around the device. Also, avoid overheating the device during soldering and rework.
  • Not using the recommended input capacitor values can lead to instability, oscillations, or reduced performance of the UCS1003-1-BP. It may also affect the device's ability to regulate the output voltage accurately.
  • While the UCS1003-1-BP is a high-quality device, it may not meet the specific requirements of high-reliability or automotive applications. Engineers should consult the device's AEC-Q100 qualification and Microchip's automotive-grade products for such applications.
  • To troubleshoot issues with the UCS1003-1-BP, check the input voltage, output load, and PCB layout. Verify that the device is operated within the recommended specifications and that the input and output capacitors are of sufficient value and quality. Use an oscilloscope to observe the output voltage and switching node waveforms.

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UCS1003-1-BP Overview

Use the download button to access the UCS1003-1-BP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like UCS10, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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