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UJA1169ATK/F/3 - NXP

Description: Mini high-speed CAN system basis chip

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UJA1169ATK/F/3 - NXP - PCB symbol
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PCB Footprints
UJA1169ATK/F/3 - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT1360-1 (HVSON2
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3D Models
UJA1169ATK/F/3 - NXP - 3D model - Small Outline No-lead - SOT1360-1 (HVSON2
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UJA1169ATK/F/3 Details

  • Manufacturer Part Number:

    UJA1169ATK/F/3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Data Rate:

    15000 Mbps

  • JESD-30 Code:

    R-PDSO-N20

  • Length:

    5.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC20,.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    67 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3.5 mm

UJA1169ATK/F/3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1169ATK/F/3 involves placing the device close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. It's also recommended to use a common ground point for the device and the battery.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which involves applying the battery voltage to the device before applying the ignition voltage. Also, ensure that the device is properly configured and initialized through the SPI interface.
  • The UJA1169ATK/F/3 has a thermal pad that must be connected to a heat sink or a thermal relief pattern on the PCB to ensure proper heat dissipation. The device can operate up to 150°C, but it's recommended to keep the junction temperature below 125°C for reliable operation.
  • To troubleshoot issues with the UJA1169ATK/F/3, start by checking the power supply and clock signals. Verify that the device is properly configured and initialized through the SPI interface. Use a logic analyzer or oscilloscope to debug the device's behavior and identify any issues with the communication protocol.
  • The UJA1169ATK/F/3 has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded to prevent ESD damage.

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UJA1169ATK/F/3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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