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UJA1169ATK/F/3Z - NXP

Description: CAN Interface IC Mini high-speed CAN system basis chip

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UJA1169ATK/F/3Z - NXP - PCB symbol
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PCB Footprints
UJA1169ATK/F/3Z - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT1360-1 (HVSON2
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3D Models
UJA1169ATK/F/3Z - NXP - 3D model - Small Outline No-lead - SOT1360-1 (HVSON2
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UJA1169ATK/F/3Z Details

  • Manufacturer Part Number:

    UJA1169ATK/F/3Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-20

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Data Rate:

    15000 Mbps

  • JESD-30 Code:

    R-PDSO-N20

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC20,.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    67 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

UJA1169ATK/F/3Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1169ATK/F/3Z involves keeping the high-current paths short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper cooling, make sure to provide a sufficient heat sink, use thermal interface material, and ensure good airflow around the device. The thermal pad of the UJA1169ATK/F/3Z should be connected to a heat sink or a thermal pad on the PCB.
  • Critical components to consider when designing a power supply with the UJA1169ATK/F/3Z include the input capacitors, output inductors, and output capacitors. These components affect the stability, efficiency, and output voltage ripple of the power supply.
  • To troubleshoot issues with the UJA1169ATK/F/3Z, start by checking the input voltage, output voltage, and current consumption. Use an oscilloscope to check for voltage spikes, ringing, or oscillations. Check the PCB layout and component values to ensure they match the recommended values.
  • Key considerations for EMI filtering with the UJA1169ATK/F/3Z include using a common-mode choke, adding X-capacitors, and using a shielded inductor. The EMI filter should be designed to meet the relevant EMI standards, such as CISPR 25.

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UJA1169ATK/F/3Z Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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