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UJA1169ATK/X/FZ - NXP

Description: CAN Interface IC Mini high-speed CAN system basis chip

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UJA1169ATK/X/FZ - NXP - PCB symbol
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PCB Footprints
UJA1169ATK/X/FZ - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT1360-1 (HVSON2
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3D Models
UJA1169ATK/X/FZ - NXP - 3D model - Small Outline No-lead - SOT1360-1 (HVSON2
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UJA1169ATK/X/FZ Details

  • Manufacturer Part Number:

    UJA1169ATK/X/FZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-20

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Data Rate:

    15000 Mbps

  • JESD-30 Code:

    R-PDSO-N20

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC20,.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    67 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

UJA1169ATK/X/FZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1169ATK/X/FZ involves placing the device close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. It's also recommended to use a common ground point for the device and the battery.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which involves applying the battery voltage to the device before applying the ignition voltage. Also, ensure that the device is properly configured and initialized through the SPI interface.
  • Thermal management is crucial for the UJA1169ATK/X/FZ. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads. Also, follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.
  • To troubleshoot issues with the UJA1169ATK/X/FZ, start by checking the power supply and battery voltage, then verify the device configuration and initialization. Use the device's diagnostic features, such as the fault flags and error codes, to identify the root cause of the issue.
  • To ensure EMC compliance, follow the recommended PCB layout and design guidelines, use proper shielding and filtering, and ensure that the device is properly decoupled from the power supply and other noisy circuits.

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UJA1169ATK/X/FZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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