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UJA1169ATK/XZ - NXP

Description: CAN Interface IC Mini high-speed CAN system basis chip

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UJA1169ATK/XZ - NXP - PCB symbol
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PCB Footprints
UJA1169ATK/XZ - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT1360-1 (HVSON2
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3D Models
UJA1169ATK/XZ - NXP - 3D model - Small Outline No-lead - SOT1360-1 (HVSON2
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UJA1169ATK/XZ Details

  • Manufacturer Part Number:

    UJA1169ATK/XZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-20

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Data Rate:

    15000 Mbps

  • JESD-30 Code:

    R-PDSO-N20

  • JESD-609 Code:

    e4

  • Length:

    5.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC20,.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    67 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

UJA1169ATK/XZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1169ATK/XZ involves placing the device close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. A 4-layer PCB with a dedicated power plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the VCC pin to a stable voltage source, and configure the device using the SPI interface. Refer to the datasheet for the recommended power-up sequence and configuration settings.
  • The UJA1169ATK/XZ has a thermal pad that must be connected to a heat sink or a thermal relief pattern on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink with a low thermal resistance.
  • To troubleshoot issues, start by checking the power supply, clock, and reset signals. Verify that the device is properly configured and that the SPI interface is functioning correctly. Use a logic analyzer or oscilloscope to debug the device's behavior.
  • The UJA1169ATK/XZ has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling.

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UJA1169ATK/XZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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