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UMD9N-TP - MCC

Description: Pre-Biased Transistors

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PCB Footprints
UMD9N-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - UMD9N-TP
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3D Models
UMD9N-TP - MCC  - 3D model - SOT23 (6-Pin) - UMD9N-TP
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UMD9N-TP Details

  • Manufacturer Part Number:

    UMD9N-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-363, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.07 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    68

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

UMD9N-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature for UMD9N-TP is -40°C to 125°C.
  • Yes, UMD9N-TP is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
  • The maximum power dissipation for UMD9N-TP is 1.5 watts, and it's essential to ensure proper thermal management to prevent overheating.
  • Yes, UMD9N-TP is designed for high-reliability applications, including aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • Yes, UMD9N-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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UMD9N-TP Overview

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