ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow ROHM's recommended operating conditions, including derating the device's power dissipation according to the ambient temperature. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
While the datasheet specifies a maximum voltage rating of 23V, it's essential to note that the device can withstand voltage transients up to 30V for a short duration (less than 100ms). However, continuous operation above 23V is not recommended.
To prevent ESD damage, follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure that all equipment and tools used during assembly are ESD-safe. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.
Store the UML23NTR in a dry, cool place with a relative humidity below 60%. Avoid storing the devices in environments with high humidity or temperature fluctuations. If the devices are stored for an extended period, consider using a dry pack or desiccant to maintain a low humidity environment.
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UML23NTR Overview
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