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UPD70F3762GC-UEU-AX - Renesas Electronics

Description: The new 32-bit V850ES/Jx3-H MCUs execute USB 2.0 data transfers at full speeds up to 12 megabits per second (Mbps), and enable rapid development of applications that require USB connectivity and 32-bit processing power for real-time control of industrial equipment, factory automation systems, point-of-sales terminals, medical and testing devices, telecommunications and consumer electronics products and other embedded applications.

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UPD70F3762GC-UEU-AX - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-PIN PLASTIC LQFP
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UPD70F3762GC-UEU-AX - Renesas Electronics  - 3D model - Quad Flat Packages - 100-PIN PLASTIC LQFP
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UPD70F3762GC-UEU-AX Details

  • Manufacturer Part Number:

    UPD70F3762GC-UEU-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KI

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    16

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    V850

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    19

  • Number of I/O Lines:

    77

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    100

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    57344

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    120 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

UPD70F3762GC-UEU-AX Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the UPD70F3762GC-UEU-AX is 20 MHz.
  • The UPD70F3762GC-UEU-AX has 768 KB of flash memory.
  • The maximum ambient temperature range for the UPD70F3762GC-UEU-AX is -40°C to +85°C.
  • Yes, the UPD70F3762GC-UEU-AX has a built-in oscillator that can be used as a clock source.
  • The power consumption of the UPD70F3762GC-UEU-AX in sleep mode is typically around 1.5 μA.

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UPD70F3762GC-UEU-AX Overview

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