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UPD70F3767GF-GAT-AX - Renesas Electronics

Description: The new 32-bit V850ES/Jx3-H MCUs execute USB 2.0 data transfers at full speeds up to 12 megabits per second (Mbps), and enable rapid development of applications that require USB connectivity and 32-bit processing power for real-time control of industrial equipment, factory automation systems, point-of-sales terminals, medical and testing devices, telecommunications and consumer electronics products and other embedded applications.

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PCB Footprints
UPD70F3767GF-GAT-AX - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP128
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3D Models
UPD70F3767GF-GAT-AX - Renesas Electronics  - 3D model - Quad Flat Packages - LQFP128
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UPD70F3767GF-GAT-AX Details

  • Manufacturer Part Number:

    UPD70F3767GF-GAT-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PLQP0128KE

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    V850

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    19

  • Number of I/O Lines:

    96

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    128

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    57344

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    120 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

UPD70F3767GF-GAT-AX Overview

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