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US1MHE3/61T - Vishay

Description: DIODE GEN PURP 1KV 1A DO214AC

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PCB Footprints
US1MHE3/61T - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC)
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3D Models
US1MHE3/61T - Vishay  - 3D model - Diodes Moulded - SMA (DO-214AC)
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US1MHE3/61T Details

  • Manufacturer Part Number:

    US1MHE3/61T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DO-214AC

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMA, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.075 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

US1MHE3/61T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the US1MHE3/61T is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.2 mm solder mask clearance.
  • Yes, the US1MHE3/61T is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the application meets the specified thermal requirements.
  • To prevent damage, handle the US1MHE3/61T by the body only, avoiding touching the leads or the glass passivation. Use anti-static wrist straps, mats, or other ESD protection methods to prevent electrostatic discharge damage.
  • The recommended soldering profile for the US1MHE3/61T is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process meets the IPC J-STD-020 standard.
  • Yes, the US1MHE3/61T is designed to operate in humid environments, with a moisture sensitivity level (MSL) of 1. However, it's essential to follow proper storage and handling procedures to prevent moisture absorption.

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US1MHE3/61T Overview

Use the download button to access the US1MHE3/61T schematic symbol, PCB footprint, and 3D model.
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