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US2M - Diotec

Description: Diode 1000 V 2A Surface Mount DO-214AA (SMB)

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US2M - Diotec - PCB symbol
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PCB Footprints
US2M - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMB~DO-214AA
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3D Models
US2M - Diotec - 3D model - Diodes Moulded - SMB~DO-214AA
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US2M Details

  • Manufacturer Part Number:

    US2M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    7

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.075 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

US2M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central thermal pad connected to a large copper area on the PCB is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Use a heat sink or thermal interface material to improve heat dissipation. Ensure good airflow and avoid blocking airflow around the device. Also, consider derating the device's power handling at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage spikes. Ensure the device is connected to a low-impedance power supply, and consider adding a fuse or PTC resettable fuse for overcurrent protection.
  • Use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste or flux, and ensure the soldering time is less than 3 seconds to prevent thermal damage.

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US2M Overview

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For a full list of alternate parts for US2M, check out Findchips.com