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US2M_HF - Diodes Incorporated

Description: Diode 1000 V 2A Surface Mount SMB

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Symbol
US2M_HF - Diodes Incorporated - PCB symbol
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PCB Footprints
US2M_HF - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMB_2026
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3D Models
US2M_HF - Diodes Incorporated - 3D model - Diodes Moulded - SMB_2026
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US2M_HF Details

  • Manufacturer Part Number:

    US2M_HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

US2M_HF Frequently Asked Questions (FAQs)

  • A good PCB layout for the US2M_HF should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended.
  • The US2M_HF has a high power density, so thermal management is crucial. Use a heat sink with a thermal interface material, ensure good airflow, and avoid blocking the airflow around the device. The recommended operating temperature range is -40°C to 150°C.
  • The maximum allowed voltage drop across the US2M_HF is 0.5V. Exceeding this voltage drop may affect the device's performance and reliability.
  • Yes, the US2M_HF is designed for high-frequency switching applications up to 1MHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and ringing.
  • The US2M_HF has a high peak current capability, so ensure that the PCB traces and components can handle the high current surges. Use thick copper traces, and select components with high current ratings to avoid overheating and damage.

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US2M_HF Overview

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